NTLJD2104P
PACKAGE DIMENSIONS
D
A
B
WDFN6 2x2
CASE 506AN ? 01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
E
DIM
A
A1
MILLIMETERS
MIN MAX
0.70 0.80
0.00 0.05
2X
2X
0.10 C
0.10 C
A3
b
D
D2
E
E2
e
0.20 REF
0.25 0.35
2.00 BSC
0.57 0.77
2.00 BSC
0.90 1.10
0.65 BSC
0.10 C
A3
K
L
J
0.25 REF
0.20 0.30
0.15 REF
A
6X
0.08 C
A1
SOLDERING FOOTPRINT*
D2
D2
C
SEATING
PLANE
6X
0.43
2.30
6X
0.35
6X
L
1
3
e
4X
1
2X E2
0.65
PITCH
6X
K
6
4
b
6X
0.25
6X J
BOTTOM VIEW
0.10 C A B
0.05 C NOTE 3
2X
0.72
1.05
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
m Cool is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NTLJD2104P/D
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